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dc.contributor.authorAkkaya, Abdullah
dc.contributor.authorAyyildiz, Enise
dc.date.accessioned2019-11-24T20:58:42Z
dc.date.available2019-11-24T20:58:42Z
dc.date.issued2016
dc.identifier.issn2214-7853
dc.identifier.urihttps://dx.doi.org/10.1016/j.matpr.2016.03.067
dc.identifier.urihttps://hdl.handle.net/20.500.12513/3140
dc.descriptionInternational Semiconductor Science and Technology Conference (ISSTC) -- MAY 11-13, 2015 -- Kusadasi, TURKEYen_US
dc.descriptionWOS: 000373069200004en_US
dc.description.abstractThe effects of thermal annealing on the electrical properties of Ni/Au Schottky contacts on n-type AlxGa1-xN (x=0.20) were investigated by current-voltage (I-V) and capacitance-voltage (C-V) measurements. The Schottky barrier height (SBH) of as-deposited contacts was found to be 0.946 +/- 0.033 eV (from I-V) and 1.120 +/- 0.047 eV (from C-V) with an ideality factor of 1.655 +/- 0.137. The values of SBH obtained from the C-V measurements were found to be higher than that of obtained from the I-V measurements. This was attributed to the presence of the lateral inhomogeneities of the barrier height. The values of SBH slightly increased after the annealing temperatures at 300, 400 and 500 degrees C. The highest value of SBH for Ni/Au Schottky contact was obtained after annealing at 600 +/- C and the value was 1.521 +/- 0.032 eV. The good performance of the annealed Ni/Au contact can be attributed to reaction of Ni with the GaN cap layer of AlGaN substrate, and formation of intermetallic compounds such as GaNi and reduced interfacial defects at the metal/GaN interface. (C) 2015 Elsevier Ltd. All rights reserved. Selection and Peer-review under responsibility of Conference Committee Members of International Semiconductor Science and Technology Conference 2015 (ISSTC 2015).en_US
dc.description.sponsorshipKavasoglu Pazarlama Ticaret Ltd Sti, Kontek Muhendislik Otomasyon Danismanlik San Tic Ltd Sti, Tekno Tip Analitik Sistemler Ltd Sti, Yildirim Elektronik, Gediz Univ Teknoloji Transfer Ofisi, Hamleen_US
dc.language.isoengen_US
dc.publisherELSEVIER SCIENCE BVen_US
dc.relation.isversionof10.1016/j.matpr.2016.03.067en_US
dc.rightsinfo:eu-repo/semantics/closedAccessen_US
dc.subjectSchottky barrier heighten_US
dc.subjectAlGaNen_US
dc.subjectElectrical propertiesen_US
dc.subjectBarrier inhomogeneityen_US
dc.subjectThermal annealingen_US
dc.titleEffect of post annealing on electrical properties of (Ni/Au)/Al0.20Ga0.80N Schottky contactsen_US
dc.typeconferenceObjecten_US
dc.relation.journalMATERIALS TODAY-PROCEEDINGSen_US
dc.contributor.departmentKırşehir Ahi Evran Üniversitesi, Mucur Meslek Yüksekokulu, Kimya ve Kimyasal İşleme Teknolojilerien_US
dc.identifier.volume3en_US
dc.identifier.issue5en_US
dc.identifier.startpage1248en_US
dc.identifier.endpage1254en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US


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